Ceramic circuit board and module using same

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United States of America Patent

PATENT NO 11570890
APP PUB NO 20210176860A1
SERIAL NO

16616902

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Abstract

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A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

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Patent Owner(s)

Patent OwnerAddress
DENKA COMPANY LIMITEDTOKYO 103-8338

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aono, Ryota Omuta, JP 6 10
Harada, Yusaku Omuta, JP 15 10
Iwakiri, Shoji Omuta, JP 4 2
Nishimura, Kouji Omuta, JP 24 236
Tsugawa, Yuta Omuta, JP 4 2

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