Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module

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United States of America Patent

PATENT NO 11575076
APP PUB NO 20200295248A1
SERIAL NO

16758166

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Abstract

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A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO 1058518

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ejiri, Yoshinori Tokyo, JP 41 146
Ishikawa, Dai Tokyo, JP 70 10378
Kawana, Yuki Tokyo, JP 28 39
Nakako, Hideo Tokyo, JP 32 112
Negishi, Motohiro Tokyo, JP 8 11
Sugama, Chie Tokyo, JP 13 30

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