Heat dissipation device

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United States of America Patent

PATENT NO 11576279
SERIAL NO

17371280

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

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Patent Owner(s)

Patent OwnerAddress
AURAS TECHNOLOGY CO LTD3F NO 6 WUQUAN 3RD RD XINZHUANG DIST NEW TAIPEI CITY 242

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Cheng-Ju New Taipei, TW 15 10
Chen, Chih-Wei New Taipei, TW 315 1688
Huang, Jyun-Wei New Taipei, TW 15 191

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