Systems and methods for etching a substrate

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United States of America Patent

PATENT NO 11581161
APP PUB NO 20200211817A1
SERIAL NO

16727706

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Abstract

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A method of processing a workpiece may include forming a first layer on a first side of a base layer. The base layer may be part of a substrate including a plurality of layers. The method may also include forming a second layer on the first layer. A material of the second layer may include metal. The method may also include forming an opening in the second layer, forming an opening in the first layer by etching, and removing the second layer. The method may include dry etching of the first layer.

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Patent Owner(s)

Patent OwnerAddress
HERMES MICROVISION INCEAST DIST HSINCHU CITY 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Jie San Jose, US 53 109
Wang, Yixiang Fremont, US 43 57
Yang, Jinmei Beijing, CN 5 7
Zhang, Haojie Beijing, CN 16 15
Zhang, Qirong Beijing, CN 1 0
Zhu, Fenghui Beijing, CN 2 0

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