Method of producing printed circuit boards with routing conductors and dielectric strands

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United States of America Patent

PATENT NO 11596054
SERIAL NO

16670374

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Abstract

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Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Jinwoo Austin, US 37 78
Mechaik, Mehdi Mohamed Austin, US 2 0
Walls, Lloyd Andre Austin, US 14 174
Zhang, Yanyan Austin, US 47 154

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