Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition
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United States of America Patent
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Apr 11, 2023
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N/A
app pub date -
Dec 15, 2017
filing date -
Dec 22, 2016
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Abstract
An adhesive composition containing (A) a modified polyolefin resin and (B) an epoxy compound, wherein the modified polyolefin resin (A) is a polyolefin resin graft modified with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof. The content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds.
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