Method and apparatus for uniformly metallization on substrate

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United States of America Patent

PATENT NO 11629425
APP PUB NO 20210156042A1
SERIAL NO

17164539

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Abstract

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The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

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Patent Owner(s)

Patent OwnerAddress
ACM RESEARCH (SHANGHAI) INCBUILDING 4 NO 1690 CAI LUN ROAD ZHANGJIANG HIGH-TECH PARK SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fuping Shanghai, CN 45 43
Wang, Hui Shanghai, CN 1115 8921
Wang, Xi Shanghai, CN 356 3114

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