Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method

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United States of America Patent

PATENT NO 11631653
APP PUB NO 20200035642A1
SERIAL NO

16478218

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Abstract

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An ultrasonic bonding apparatus includes an ultrasonic bonding machine having an ultrasonic tool for applying an ultrasonic wave to a bonding target member mounted on a fixed object fixed to a jig, while pressing a bonding member against the bonding target member; and a bonding inspection apparatus for inspecting a bonding quality of the bonding target member and the bonding member. The bonding inspection apparatus includes: a bonded-state measuring device for detecting a vibration in the jig or a housing of the ultrasonic bonding machine equipped with the jig, to thereby output a detection signal; and a bonded-state determination device for determining, in a bonding process for the bonding target member and the bonding member, a bonded state between the bonding target member and the bonding member on the basis of the detection signal outputted by the bonded-state measuring device.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONTOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Egusa, Minoru Tokyo, JP 6 38
Hashimoto, Kazuyuki Tamba, JP 91 495
Sudo, Shingo Tokyo, JP 15 148
Suzuki, Erubi Tamba, JP 4 4

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