Method for manufacturing embedded circuit board, embedded circuit board, and application
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United States of America Patent
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Apr 18, 2023
Grant Date -
N/A
app pub date -
Dec 28, 2020
filing date -
Jul 7, 2019
priority date (Note) -
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Abstract
The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.
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