Component package and printed circuit board for the same

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United States of America Patent

PATENT NO 11638346
SERIAL NO

17205268

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO KOREA SUWON SUWON GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Seon Ha Suwon-si, KR 13 92
Kim, Yong Hoon Suwon-si, KR 83 504

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