Method for manufacturing wiring board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11665829
APP PUB NO 20210204409A1
SERIAL NO

17122021

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI AICHI-KEN 471-8571

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondoh, Haruki Okazaki, JP 20 7
Kuroda, Keiji Toyota, JP 42 378
Mori, Rentaro Kasugai, JP 25 115
Okamoto, Kazuaki Toyota, JP 61 183
Yanagimoto, Hiroshi Miyoshi, JP 42 152

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