Heat pump
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United States of America Patent
Stats
-
Jun 13, 2023
Grant Date -
Nov 26, 2020
app pub date -
Dec 28, 2018
filing date -
Dec 29, 2017
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A device for heating by absorbing latent heat of solidification of water, including a compressor (1), a condenser (2) and multiple evaporators (E1, E2) connected in parallel, each evaporator (E1, E2) has an electronic expansion valve (D1, D2) at its inlet, a solenoid valve (V1, V2) at its outlet; after the evaporators (E1, E2) are connected in parallel, outlets of the evaporators (E1, E2) are connected to an inlet of the compressor (1) and inlets of the evaporators (E1, E2) are connected to an outlet of the condenser (2); an outlet of the compressor (1) is connected to an inlet of the condenser (2); the compressor (1), the condenser (2) and the multiple parallel evaporators (E1, E2) form a closed loop system through pipelines; there are circulating refrigerants in the closed loop system, and heating and deicing processes are realized through a circulation of refrigerants; the solenoid valves (V1, V2) at the outlets of the evaporators (E1, E2) are switched between opening or closing to realize switching between evaporating and deicing functions of the evaporators (E1, E2).

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
YANG JI | NO 65 BUILDING 10 MIHA STATION LONGTAN DISTRICT JILIN CITY JILIN PROVINCE CHINA 132000 JILIN CITY JILIN PROVINCE 132000 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Yang, Ji | Hunan, CN | 56 | 259 |
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