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United States of America Patent

PATENT NO 11688607
APP PUB NO 20200357653A1
SERIAL NO

16940287

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Abstract

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The present disclosure provides a slurry. The slurry includes an abrasive including a ceria compound; a removal rate regulator to adjust removal rates of the slurry to metal and to dielectric material; and a buffering agent to adjust a pH value of the slurry, wherein the slurry comprises a dielectric material removal rate higher than a metal oxide removal rate.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Huang-Lin Hillsboro, US 118 101
Hsu, Chung-Wei Hsinchu County, TW 132 258
Lee, An-Hsuan Hsinchu, TW 15 2
Lee, Shen-Nan Hsinchu County, TW 56 195
Liao, Chun-Hung Taichung, TW 31 13
Tsai, Teng-Chun Hsinchu, TW 275 2741
Tsai, Tsung-Ling Hsinchu, TW 14 24
Wu, Chen-Hao Hsinchu, TW 36 31

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