Case molding capacitor having improved horizontal degree
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United States of America Patent
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Aug 1, 2023
Grant Date -
Feb 23, 2023
app pub date -
Jun 29, 2021
filing date -
Dec 10, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.
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