Gas phase etch with controllable etch selectivity of metals

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11715643
APP PUB NO 20210020454A1
SERIAL NO

16890141

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method for the dry removal of a material on a microelectronic workpiece is described. The method includes receiving a substrate having a working surface exposing a metal layer and having at least one other material exposed or underneath the metal layer; and differentially etching the metal layer relative to the other material by exposing the substrate to a controlled gas-phase environment containing an anhydrous halogen compound.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO 107-6325

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Flaugh, Matthew Albany, US 4 2
Ito, Daisuke Hillsboro, US 466 2877
Kal, Subhadeep Albany, US 34 340
Mosden, Aelan Hopewell Junction, US 37 477
Muraki, Yusuke Yamanashi, JP 21 384

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Feb 1, 2027
7.5 Year Payment $3600.00 $1800.00 $900.00 Feb 1, 2031
11.5 Year Payment $7400.00 $3700.00 $1850.00 Feb 1, 2035
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00