Wafer processing method including crushed layer and wafer processing apparatus

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United States of America Patent

PATENT NO 11721584
APP PUB NO 20210233814A1
SERIAL NO

17142429

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Abstract

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A wafer is processed by irradiating a region to be divided with a pulse laser beam with a wavelength having absorbability to generate a thermal stress wave and propagate the wave to the inside of the region to be divided. A crushed layer is formed by executing irradiation, with a pulse laser beam with a wavelength having transmissibility with respect to the wafer, matching with a time when the thermal stress wave is generated and reaching a depth position at which a point of origin of dividing is to be generated at a sonic speed according to the material of the wafer. Absorption of the pulse laser beam with the wavelength having the transmissibility in a region in which the band gap is narrowed due to a tensile stress of the thermal stress wave forms a crushed layer that serves as the point of origin of dividing.

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Patent Owner(s)

Patent OwnerAddress
DISCO CORPORATIONTOKYO 143-8580

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nomaru, Keiji Tokyo, JP 123 635

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