Electroless metal-defined thin pad first level interconnects for lithographically defined vias

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United States of America Patent

PATENT NO 11728258
SERIAL NO

17536711

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Abstract

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A package substrate, comprising a package comprising a substrate, the substrate comprising a dielectric layer, a via extending to a top surface of the dielectric layer; and a bond pad stack having a central axis and extending laterally from the via over the first layer. The bond pad stack is structurally integral with the via, wherein the bond pad stack comprises a first layer comprising a first metal disposed on the top of the via and extends laterally from the top of the via over the top surface of the dielectric layer adjacent to the via. The first layer is bonded to the top of the via and the dielectric layer, and a second layer is disposed over the first layer. A third layer is disposed over the second layer. The second layer comprises a second metal and the third layer comprises a third metal. The second layer and the third layer are electrically coupled to the via.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATIONSANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aleksov, Aleksandar Chandler, US 321 1479
Darmawikarta, Kristof Chandler, US 170 208
Sarkar, Arnab Chandler, US 41 459
Strong, Veronica Chandler, US 52 99

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