High temperature epoxy adhesive formulations

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United States of America Patent

PATENT NO 11739241
APP PUB NO 20210155835A1
SERIAL NO

16613501

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Abstract

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The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.

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Patent Owner(s)

Patent OwnerAddress
DDP SPECIALTY ELECTRONIC MATERIALS US LLC974 CENTRE ROAD WILMINGTON DE 19805

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aschwanden, Marcel Freienbach, CH 7 2
Haag, Benjamin Alexander Horgen, CH 4 6
Lutz, Andreas Freienbach, CH 122 1158
Maeder, Irene Freienbach, CH 4 18
Schneider, Daniel Freienbach, CH 170 1278

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