Application of nano copper in cutting fluid

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United States of America Patent

PATENT NO 11739285
APP PUB NO 20220145210A1
SERIAL NO

17581971

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Abstract

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The present invention provides an application of nano copper in a cutting fluid. The nano copper is self-dispersible nano copper with an organic long-carbon chain, wherein the surface of copper metal is coated with a long carbon chain organic matter, and the long chain organic matter is dialkyl dithiophosphoric acid (HDDP) and a derivative thereof. In the present invention, the nano copper substitutes functional additives which comprises one or more of a preservative, an anti-rust agent, a sterilizing agent, a compression-resisting agent and a lubricant to solve the technical problems of the existing fluid in the prior art being unable to simultaneously have efficient anti-corrosion, anti-rust, compression-resistant, lubricating and sterilizing properties as well as the variety, the relatively high amount, the high cost and the limited selection of added additives.

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Patent Owner(s)

Patent OwnerAddress
FRANCOOL TECHNOLOGY (SHENZHEN) CO LTDNO 1-2 HEBEI VILLAGE HUALIAN COMMUNITY LONGHUA STREET LONGHUA NEW DISTRICT SHENZHEN GUANGDONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fan, Langgui Shenzhen, CN 1 0
Liu, Dexiu Shenzhen, CN 2 0
Zhang, Jun Shenzhen, CN 1152 7034
Zhao, Yang Shenzhen, CN 432 4884

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