Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process

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United States of America Patent

PATENT NO 11745302
APP PUB NO 20210205951A1
SERIAL NO

17209137

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Abstract

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Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bajaj, Rajeev Fremont, US 162 3380
Chockalingam, Ashwin Santa Clara, US 31 596
Fu, Boyi San Jose, US 39 664
Fung, Jason G Santa Clara, US 28 673
Ganapathiappan, Sivapackia Los Altos, US 234 1902
Ng, Hou T Campbell, US 242 6041
Orilall, Mahendra C Downingtown, US 32 855
Redfield, Daniel Morgan Hill, US 65 1172
Yamamura, Mayu San Mateo, US 24 525

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