Automated lamination system and method for embedding printed electronic elements in a composite structure

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United States of America Patent

PATENT NO 11745440
APP PUB NO 20210308961A1
SERIAL NO

16840315

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Abstract

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There is provided an automated lamination system for embedding printed electronic element(s) in a composite structure. The automated lamination system includes a supply of composite prepreg material, a layup tool assembly, and a modified automated lamination apparatus laying up layer(s) of the composite prepreg material on the layup tool assembly, to form the composite structure. The modified automated lamination apparatus includes a section preparation pre-printing apparatus preparing section(s) on a top surface of a top layer of the layer(s), to obtain prepared section(s), and includes a non-contact direct write printing apparatus mechanically coupled to the section preparation pre-printing apparatus, and includes one or more supplies of electronic element materials, printed with the non-contact direct write printing apparatus, on each of the prepared section(s), to obtain the printed electronic element(s), that are embedded in the composite structure. The automated lamination system further includes a control system and a power system.

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY100 NORTH RIVERSIDE PLAZA CHICAGO IL 60606-1596

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Humfeld, Keith Daniel Federal Way, US 78 204
Zhao, Da Everett, US 9 17

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