Process for producing and using a W—Ni sputtering target

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United States of America Patent

PATENT NO 11746409
APP PUB NO 20210246544A1
SERIAL NO

17235003

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Abstract

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A process for producing a W—Ni sputtering target includes providing the sputtering target with 45 to 75 wt % W and a remainder of Ni and common impurities. The sputtering target contains a Ni(W) phase, a W phase and no or less than 10% by area on average of intermetallic phases measured at a target material cross section.

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Patent Owner(s)

Patent OwnerAddress
PLANSEE SE6600 REUTTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Linke, Christian Ehenbichl, AT 19 22
Scherer, Thomas Lechaschau, AT 68 1039

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