Polishing method, and polishing composition and method for producing the same

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United States of America Patent

PATENT NO 11749531
APP PUB NO 20190080927A1
SERIAL NO

16123632

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Abstract

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A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition containing abrasive grains, a tri- or more polyvalent hydroxy compound and a dispersing medium and having pH of less than 6.0.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDKIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ide, Kenta Kiyosu, JP 31 48
Izawa, Yoshihiro Kiyosu, JP 35 574

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