Method for cleaning semiconductor wafers

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United States of America Patent

PATENT NO 11752529
APP PUB NO 20180071795A1
SERIAL NO

15814246

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Abstract

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A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

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Patent Owner(s)

Patent OwnerAddress
ACM RESEARCH (SHANGHAI) INCBUILDING 4 NO 1690 CAI LUN ROAD ZHANGJIANG HIGH-TECH PARK SHANGHAI 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Fufa Cupertino, US 30 893
Chen, Fuping Shanghai, CN 45 43
Jia, Zhaowei Shanghai, CN 38 48
Jin, Yinuo Shanghai, CN 21 23
Li, Xuejun Shanghai, CN 57 510
Wang, Hui Fremont, US 1115 8921
Wang, Jian Shanghai, CN 1906 17240
Wang, Jun Shanghai, CN 2215 18848
Wang, Xi Shanghai, CN 356 3114
Xie, Liangzhi Shanghai, CN 33 68
Zhang, Xiaoyan Shanghai, CN 147 1153

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