System and method for particle abatement in a wafer processing tool

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United States of America Patent

PATENT NO 11772136
SERIAL NO

17470946

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Abstract

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A method for particle abatement in a wafer processing tool implements at least one cleaning-purposed mobile electrostatic carrier (MESC) including electrostatic field generating (EFG) circuits. Each EFG circuit is charged with the cleaning-purposed MESC. The cleaning-purposed MESC is then loaded into the wafer processing tool in a facedown orientation. A normal-purposed MESC is loaded into the wafer processing tool in a faceup orientation. Next, foreign materials are bonded to the cleaning-purposed MESC as the cleaning-purposed MESC is moved along a processing path through the wafer processing tool in the facedown orientation. The normal-purposed MESC travels the processing path during normal operation of the wafer processing tool in the faceup orientation. The cleaning-purposed MESC is then unloaded from the wafer processing tool. Next, the foreign materials are debonded from the cleaning-purposed MESC by discharging each EFG circuit with the cleaning-purposed MESC. Finally, the foreign materials are removed off the cleaning-purposed MESC.

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Patent Owner(s)

Patent OwnerAddress
SMITH ERYNDANVILLE CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Smith, Eryn Danville, US 14 51

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