Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11773254
APP PUB NO 20200283619A1
SERIAL NO

16756518

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Abstract

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An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

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Patent Owner(s)

Patent OwnerAddress
3M INNOVATIVE PROPERTIES COMPANYP O BOX 33427 ST PAUL MN 55133-3427

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beiermann, Brett A St. Paul, US 16 73
Charles, Scott B Spring Valley, US 13 176
Clark, John C Maplewood, US 78 1101
Fletcher, Timothy D Lino Lakes, US 23 309
Forticaux, Audrey S Minneapolis, US 5 1
Higgins, Jeremy M Roseville, US 18 9
Larson, Eric G Lake Elmo, US 50 2040
Lomeda, Jay R St. Paul, US 9 76
Mahoney, Wayne S St. Paul, US 81 787
Schwartz, Kyle R Maplewood, US 2 0
Thompson, Wendy L Roseville, US 46 882

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