Dielectric heating of foamable compositions

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United States of America Patent

PATENT NO 11773297
SERIAL NO

17454864

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Abstract

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A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAARUHRSTRASSE 19 HAMBURG 22761

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Getty, Kris Deerfield, US 9 64
Huang, Tianjian Hillborough, US 35 212
Kriegl, Alexis Pittstown, US 9 28
McLeod, Bradley Bloomsbury, US 7 35
Waski, Daniel Elmhurst, US 23 162

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