Polishing liquid, polishing liquid set, and polishing method

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United States of America Patent

PATENT NO 11814548
SERIAL NO

17490431

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Abstract

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A polishing liquid containing abrasive grains, a hydroxy acid, a polyol, a cationic compound, and a liquid medium, in which a zeta potential of the abrasive grains is positive and a weight average molecular weight of the cationic compound is less than 1000.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Tomoyasu Tokyo, JP 23 106
Iwano, Tomohiro Tokyo, JP 56 332
Matsumoto, Takaaki Tokyo, JP 30 156

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