Etchant for selectively etching copper and copper alloy, and method for manufacturing semiconductor substrate using said etchant

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United States of America Patent

PATENT NO 11821092
SERIAL NO

17287049

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Abstract

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An etchant capable of selectively etching copper and a copper alloy while suppressing dissolution of nickel, tin, gold, and an alloy thereof. The etchant contains: (A) 5-10.5% by mass of hydrogen peroxide with respect to the total mass of the etchant; (B) 0.3-6% by mass of nitric acid with respect to the total mass of the etchant; (C) at least one nitrogen-containing 5-membered ring compound selected from triazoles and tetrazoles, which may have at least one substituent selected from a C1-6 alkyl group, an amino group, and a substituted amino group having a substituent selected from a C1-6 alkyl group and a phenyl group; and (D) (d1) one or more pH adjusters selected from an alkali metal hydroxide, ammonia, an amine, and an ammonium salt, (d2) a phosphoric acid compound, or (d3) a combination of (d1) and (d2).

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI GAS CHEMICAL COMPANY INCTOKYO 100-8324

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Tomoko Ashigarakami-gun, JP 13 70
Fukazawa, Shun Ashigarakami-gun, JP 2 0
Matsunaga, Hiroshi Ashigarakami-gun, JP 116 1054

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