Ti-Nb alloy sputtering target and production method thereof

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United States of America Patent

PATENT NO 11837449
APP PUB NO 20190115196A1
SERIAL NO

16088118

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Abstract

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Provided is a Ti—Nb alloy sputtering target containing 0.1 to 30 at % of Nb, the remainder of Ti and unavoidable impurities; and the Ti—Nb alloy sputtering target is characterized by having an oxygen content of 400 wtppm or less. Since the target in the present disclosure has a favorable surface texture with a low oxygen content and is readily processable due to the low hardness of the target, the Ti—Nb alloy sputtering target yields a superior effect of being able to suppress the generation of particles during sputtering.

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Patent Owner(s)

Patent OwnerAddress
JX METALS CORPORATIONTOKYO 105-8417

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asano, Takayuki Ibaraki, JP 14 63
Oda, Kunihiro Ibaraki, JP 32 319

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