Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material

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United States of America Patent

PATENT NO 11840648
APP PUB NO 20200399506A1
SERIAL NO

16767908

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Abstract

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Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 105-8518

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayasaka, Tsuyoshi Tokyo, JP 6 10
Inaba, Yoshihito Tokyo, JP 5 3
Kawamori, Takashi Tokyo, JP 51 329
Miyazawa, Emi Tokyo, JP 12 27
Nishido, Keisuke Tokyo, JP 5 3
Sukata, Shinichiro Tokyo, JP 2 1

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