Inductor built-in substrate
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United States of America Patent
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Dec 26, 2023
Grant Date -
Jun 24, 2021
app pub date -
Dec 16, 2020
filing date -
Dec 18, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.
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