Substrate treatment method and substrate treatment device

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United States of America Patent

PATENT NO 11875991
APP PUB NO 20210257209A1
SERIAL NO

16973554

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Abstract

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A substrate treatment method according to an embodiment of the present disclosure includes a temperature raising step of raising a temperature of a concentrated sulfuric acid, and a liquid supply step of supplying the concentrated sulfuric acid having the raised temperature to a substrate placed on a substrate processing part.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDAKASAKA BIZ TOWER 3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kagawa, Koji Kumamoto, JP 20 28

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