Semiconductor device with a transmitting insulating element
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United States of America
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Feb 6, 2024
Grant Date -
N/A
app pub date -
Sep 3, 2021
filing date -
Sep 3, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.
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