Miniaturized impedance sensors
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United States of America Patent
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Feb 6, 2024
Grant Date -
N/A
app pub date -
Oct 30, 2019
filing date -
Oct 30, 2019
priority date (Note) -
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Abstract
A method, system, apparatus, and/or device with a miniaturized impedance sensor. The method, system, apparatus, and/or device may include a substrate with locally non-flexible regions interconnected by a flexible material and a miniaturized impedance sensor disposed on the substrate. The miniaturized impedance sensor may include: an array of electrical contacts; an array of miniaturized electrodes disposed on the array of electrical contacts; and an interstitial filler disposed within the array of miniaturized electrodes. The locally non-flexible regions may correspond to subsets of the array of miniaturized electrodes. The locally non-flexible regions may retain shape as the flexible material changes shape.
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