Method for manufacturing connection body and method for connecting component

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United States of America Patent

PATENT NO 11901096
APP PUB NO 20210225550A1
SERIAL NO

17054387

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Abstract

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A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.

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Patent Owner(s)

Patent OwnerAddress
DEXERIALS CORPORATION1724 SHIMOTSUBOYAMA SHIMOTSUKE-SHI TOCHIGI 323-0194

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aizaki, Ryota Tochigi, JP 4 9
Asaba, Kosuke Tochigi, JP 3 1

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