Electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials

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United States of America Patent

PATENT NO 11904400
APP PUB NO 20230294189A1
SERIAL NO

17733109

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This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.

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Patent Owner(s)

Patent OwnerAddress
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY410114 NO 960 SECOND SECTION OF WANJIALI SOUTH ROAD TIANXIN DISTRICT CHANGSHA CITY HUNAN PROVINCE CHANGSHA CITY HUNAN PROVINCE 410114

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ziyang Hunan, CN 8 2
Hu, Yongle Hunan, CN 5 0
Li, Wei Hunan, CN 2284 14552
Luo, Yuanqiang Hunan, CN 2 0
Mao, Cong Hunan, CN 13 4
Ren, Yinghui Hunan, CN 2 0
Shi, Feng Hunan, CN 154 802
Tang, Kun Hunan, CN 46 107
Tang, Weidong Hunan, CN 31 366
Wen, Zhuo Hunan, CN 2 0
Wu, Gang Hunan, CN 243 2891
Zhang, Mingjun Hunan, CN 17 26

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