Semiconductor fabricating method

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United States of America Patent

PATENT NO 11915939
APP PUB NO 20230005749A1
SERIAL NO

17277986

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Abstract

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A semiconductor fabricating method for a film to be processed containing a transition metal on an upper surface of a semiconductor wafer placed in a processing chamber in a container being etched with a gas for complexing the transition metal supplied into the processing chamber, including a first step of adsorbing, to the film, the complexing gas, while supplying the complexing gas, then increasing a temperature of the wafer to form an organic metal complex on a surface of the film, and volatilizing and desorbing the organic metal complex, and a second step of adsorbing, to the surface of the film, the complexing gas at a low temperature, while supplying the complexing gas, then stopping the supply of the complexing gas, and stepwise increasing the temperature of the wafer to volatilize and desorb an organic metal complex formed on the surface of the film.

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH CORPORATIONTOKYO 105-6409

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujisaki, Sumiko Tokyo, JP 14 113
Yamaguchi, Yoshihide Tokyo, JP 45 734

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