Etching composition and application thereof

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United States of America

PATENT NO 11920073
SERIAL NO

17486963

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Abstract

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The present disclosure discloses an etching composition. The etching composition includes: a component A: oxidizing agent 1-30 wt %; a component B: inorganic acid 0.5-20 wt %; a component C: organic acid 0-15 wt %; a component D: chelating agent 0.01-15 wt %; a component E: ionic compound and/or other inorganic acids except the inorganic acid in the component B 0-0.1 wt %; and deionized water.

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Patent Owner(s)

Patent OwnerAddress
PHICHEM CORPORATION2999 PANJING ROAD BAOSHAN SHANGHAI 201908

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Xiaoyi Shanghai, CN 4 1
Hu, Hangjian Shanghai, CN 2 1

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