Wafer grinding wheel

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11931861
APP PUB NO 20200198084A1
SERIAL NO

16417896

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Abstract

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A grinding wheel includes a plurality of wheel tips. The plurality of wheel tips include a plurality of diamond abrasive grains and a bonding material mixed with the diamond abrasive grains. The plurality of diamond abrasive grains have a ratio of a length in a long axis direction to a width in a short axis direction of 1:2.5 to 1:3.5 and includes edges or vertices having a grinding angle of 90° or less.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Sang Il Hwaseong-si, KR 10 27
Jeon, Seong Gi Hwaseong-si, KR 3 1
Jeong, Chang Su Hwaseong-si, KR 1 0
Kang, Tae Gyu Hwaseong-si, KR 25 219

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