Substrate processing method and substrate processing apparatus

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United States of America Patent

PATENT NO 11935736
APP PUB NO 20210313171A1
SERIAL NO

17266672

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Abstract

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A substrate processing method for removing liquid on a substrate having an uneven pattern formed on a surface of the substrate and drying the substrate. The substrate processing method includes: forming a laminate having a two-layer structure including a first material in a solid state forming a lower layer and a second material in a solid state forming an upper layer, in a concave portion of the pattern; removing the second material from the concave portion by performing at least one of a heating process, a light-emitting process, and a reaction process using gas with respect to the second material to sublimate, decompose, and gas-react the second material; and removing the first material from the concave portion by performing at least one of the heating process, the light-emitting process, and the reaction process using gas with respect to the first material to sublimate, decompose, and gas-react the first material.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO 107-6325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higuchi, Rintaro Koshi, JP 4 1
Nakamori, Mitsunori Koshi, JP 29 215
Ogata, Tsunemoto Koshi, JP 3 0

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