Apparatus and method for wafer cleaning

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United States of America Patent

PATENT NO 11958090
APP PUB NO 20230017404A1
SERIAL NO

17875658

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Abstract

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The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Bo Chen Hsinchu, TW 7 10
Tsai, Yung-Li Houlong Town, TW 15 21
Wu, Sheng-Wei Zhubei, TW 17 41

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