Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

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United States of America Patent

PATENT NO 11963308
APP PUB NO 20210251085A1
SERIAL NO

17052545

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Abstract

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The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

    (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy,(ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole,(ii-b) one or more than one organic acid and/or salts thereof,(ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and(ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBH10553 BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Wonjin Berlin, DE 14 34
Hahn, Aaron Berlin, DE 1 0
Honda, Toshio Berlin, DE 56 1430
Kloppisch, Mirko Berlin, DE 3 8
Lützow, Norbert Berlin, DE 7 6
Lager, Markku Berlin, DE 4 1
Schmidt, Gabriela Berlin, DE 3 4
Tang, Felix Berlin, DE 2 0
Tews, Dirk Berlin, DE 12 34
Thoms, Martin Berlin, DE 7 12

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