Method and device for milling large-diameter aspheric surface by using splicing method and polishing method

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United States of America

PATENT NO 11969805
SERIAL NO

17440739

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Abstract

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A method and device for milling a large-diameter aspheric surface by using a splicing method and a polishing method to solve the problems of large time consumption and serious tool wear in the machining of a meter-scale large-diameter aspheric surface are disclosed. where an aspheric surface is discretized into a series of rings with different radii, and the rings are sequentially machined via generating cutting by using an annular grinding wheel tool with an outer diameter less than ¼ of a diameter of the aspheric surface; the rings are equally spaced, there are a total of N rings, and a width of any ring is jointly determined by the Nth ring, the (N−1)th ring, positioning accuracy and a generatrix equation of the aspheric surface; and the aspheric surface is enveloped by a large number of rings. A contact area between the tool and a workpiece surface is rings.

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Patent Owner(s)

Patent OwnerAddress
SOOCHOW UNIVERSITYNO 199 REN'AI ROAD SUZHOU INDUSTRIAL PARK SUZHOU JIANGSU 215123

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Xi Suzhou, CN 903 6756
Dai, Zhuocheng Suzhou, CN 2 0
Guo, Peiji Suzhou, CN 5 0
Li, Chenchao Suzhou, CN 2 0
Zhu, Yongxiang Suzhou, CN 6 41

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