Conductive paste and conductive film formed using the same

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United States of America Patent

PATENT NO 11970631
APP PUB NO 20220403183A1
SERIAL NO

17805328

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

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Patent Owner(s)

  • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuno, Koso Osaka, JP 22 59
Ohashi, Naomichi Hyogo, JP 23 85

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