Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11970634
APP PUB NO 20220411674A1
SERIAL NO

17823294

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Importance

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Abstract

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The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAAHENKELSTRASSE 67 DUESSELDORF 40589

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Tianjian Hillsborough, US 35 212
Meccia, John Ringoes, US 17 75
Thompson, Kristina Clinton, US 18 89
Waski, Daniel Elmhurst, US 23 162

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Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Oct 30, 2027
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