Semiconductor package and method for manufacturing the same

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United States of America

PATENT NO 11973048
SERIAL NO

17521786

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Abstract

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A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INCKAOSIUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ching-Ho Kaohsiung, TW 13 127
Huang, Ching-Han Kaohsiung, TW 28 72
Wen, An-Nong Kaohsiung, TW 8 41

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