Method and system for process and temperature compensation in a transimpedance amplifier using a dual replica

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United States of America Patent

PATENT NO 11973471
APP PUB NO 20230163729A1
SERIAL NO

18158791

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Abstract

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The present disclosure provides for process and temperature compensation in a transimpedance amplifier (TIA) using a dual replica via monitoring an output of a first TIA (transimpedance amplifier) and a second TIA; configuring a first gain level of the first TIA based on a feedback resistance and a reference current applied at an input to the first TIA; configuring a second gain level of the second TIA and a third TIA based on a control voltage; and amplifying a received electrical current to generate an output voltage using the third TIA according to the second gain level. In some embodiments, one or both of the second TIA and the third TIA include a configurable feedback impedance used in compensating for changes in the second gain level due to a temperature of the respective second or third TIA via the configurable feedback impedance of the respective second or third TIA.

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Patent Owner(s)

Patent OwnerAddress
CISCO TECHNOLOGY INC170 WEST TASMAN DRIVE SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Balardeta, Joseph Encinitas, US 71 1228
Barabas, Stefan West Melbourne, US 9 12
Denton, Scott Escondido, US 71 1429
Pang, Simon San Diego, US 50 846

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