Heat-expandable microspheres and application thereof

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United States of America Patent

PATENT NO 11980863
APP PUB NO 20210275982A1
SERIAL NO

17259242

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Abstract

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Heat-expandable microspheres containing a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing acrylonitrile, methacrylonitrile and acrylate ester and which satisfies specific conditions 1 and 2, where Condition 1: the amount of the acrylonitrile (A)

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Patent Owner(s)

Patent OwnerAddress
MATSUMOTO YUSHI-SEIYAKU CO LTD1-3 SHIBUKAWA-CHO 2-CHOME YAO-SHI OSAKA 581-0075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Nobuaki Yao, JP 15 59
Miki, Katsushi Yao, JP 26 204
Tokumura, Sachiko Yao, JP 7 39

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