Adhesive composition for semiconductor circuit connection and adhesive film containing the same

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United States of America

PATENT NO 11993731
SERIAL NO

17266023

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Abstract

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The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDSEOUL 07336

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Minsu Daejeon, KR 21 96
Kim, Ju Hyeon Daejeon, KR 16 25
Kim, Junghak Daejeon, KR 23 135
Kim, Youngsam Daejeon, KR 27 118
Kyung, You Jin Daejeon, KR 14 166
Lee, Kwang Joo Daejeon, KR 52 74

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